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The Prime Radeon™ RX 9070 XT White Edition delivers primal performance in a compact 2.5-slot design for broad compatibility, and it features a phase-change GPU thermal pad alongside a triple-fan configuration for enhanced cooling.

The Prime Radeon™ RX 9070 XT White Edition delivers primal performance in a compact 2.5-slot design for broad compatibility, and it features a phase-change GPU thermal pad alongside a triple-fan configuration for enhanced cooling.

The card uses a 2.5-slot layout with a deliberately arranged shroud, heatsink, and heat pipes to let the three Axial-tech fans take advantage of chassis side-panel ventilation and deliver strong thermal performance.

The card uses a 2.5-slot layout with a deliberately arranged shroud, heatsink, and heat pipes to let the three Axial-tech fans take advantage of chassis side-panel ventilation and deliver strong thermal performance.

Three Axial-tech fans use a smaller hub to enable longer blades and include a barrier ring that increases downward air pressure, lowering temperatures and noise while improving overall cooling performance.
Three Axial-tech fans use a smaller hub to enable longer blades and include a barrier ring that increases downward air pressure, lowering temperatures and noise while improving overall cooling performance.


All three fans stop when GPU temperatures are below 55°C so you can run light tasks or less demanding games in near silence; they restart once temperatures exceed 60°C, creating a speed curve that balances acoustics and performance.

All three fans stop when GPU temperatures are below 55°C so you can run light tasks or less demanding games in near silence; they restart once temperatures exceed 60°C, creating a speed curve that balances acoustics and performance.

ASUS MaxContact increases the heat spreader's surface area by 5% compared to traditional designs, and when paired with the extensive heatsink array and Axial-tech fans it can improve temperatures by up to 2°C.
ASUS MaxContact increases the heat spreader's surface area by 5% compared to traditional designs, and when paired with the extensive heatsink array and Axial-tech fans it can improve temperatures by up to 2°C.


A premium phase-change GPU thermal pad melts to fill gaps between the GPU and the thermal module, providing superior thermal conductivity and enhanced heat dissipation to help maintain performance and longevity under heavy loads.

A premium phase-change GPU thermal pad melts to fill gaps between the GPU and the thermal module, providing superior thermal conductivity and enhanced heat dissipation to help maintain performance and longevity under heavy loads.

Choose between Performance mode, which lets the fans run more aggressively to keep core temperatures lower, and Quiet mode, which preserves the same power target and top-end settings but uses a gentler fan curve for quieter operation at moderate temperatures.
Choose between Performance mode, which lets the fans run more aggressively to keep core temperatures lower, and Quiet mode, which preserves the same power target and top-end settings but uses a gentler fan curve for quieter operation at moderate temperatures.


A reinforced backplate adds structural rigidity to the PCB to help prevent flex and to protect components and trace pathways from damage during installation and use.

A reinforced backplate adds structural rigidity to the PCB to help prevent flex and to protect components and trace pathways from damage during installation and use.

TUF GAMING B850-BTF WIFI W combines the essential elements of the latest AMD Ryzen™ processors with game-ready features and proven durability. “BTF” (Back To (the) Future) uses a hidden-connector layout that tucks connectors beneath the motherboard for cleaner cable routing, and includes a graphics-card high-power slot capable of delivering up to 600 watts through the motherboard. The platform supplies the power and connectivity demanded by advanced AI PC applications.

TUF GAMING B850-BTF WIFI W combines the essential elements of the latest AMD Ryzen™ processors with game-ready features and proven durability. “BTF” (Back To (the) Future) uses a hidden-connector layout that tucks connectors beneath the motherboard for cleaner cable routing, and includes a graphics-card high-power slot capable of delivering up to 600 watts through the motherboard. The platform supplies the power and connectivity demanded by advanced AI PC applications.

The hidden-connector design simplifies cable routing for first-time builders by placing connectors on the underside of the motherboard, producing a neat, expert-quality appearance without visible cables. * This motherboard is compatible with specific case models.

The hidden-connector design simplifies cable routing for first-time builders by placing connectors on the underside of the motherboard, producing a neat, expert-quality appearance without visible cables. * This motherboard is compatible with specific case models.

The graphics card high-power slot is designed to supply the wattage that BTF graphics cards require, delivering up to 600 watts through the motherboard itself and removing the need for visible 8-pin or 16-pin power cables on the front. * This motherboard is compatible with specific case models.
The graphics card high-power slot is designed to supply the wattage that BTF graphics cards require, delivering up to 600 watts through the motherboard itself and removing the need for visible 8-pin or 16-pin power cables on the front. * This motherboard is compatible with specific case models.


Stable power is essential for high-core-count AMD CPUs. This motherboard implements 14(80A) + 2(80A) + 1(80A) power stages that integrate high-side and low-side MOSFETs and drivers into packages rated for up to 80A each, ensuring efficient, stable power delivery and strong performance headroom for current and future AMD processors.

Stable power is essential for high-core-count AMD CPUs. This motherboard implements 14(80A) + 2(80A) + 1(80A) power stages that integrate high-side and low-side MOSFETs and drivers into packages rated for up to 80A each, ensuring efficient, stable power delivery and strong performance headroom for current and future AMD processors.

Comprehensive memory-tuning options let you extract more performance from DDR5 modules — including support for up to DDR5 8000+ MT/s(OC). ASUS Enhanced Memory Profile (AEMP) provides optimized frequency, timing and voltage profiles for supported memory kits to simplify overclocking.
Comprehensive memory-tuning options let you extract more performance from DDR5 modules — including support for up to DDR5 8000+ MT/s(OC). ASUS Enhanced Memory Profile (AEMP) provides optimized frequency, timing and voltage profiles for supported memory kits to simplify overclocking.


The motherboard includes one PCIe 5.0 M.2 slot to enable the fastest data transfers of up to 128 Gbps*, and all M.2 slots support NVMe RAID configurations to leverage current high-speed storage options. * Actual transmission speed will be lower than theoretical maximum speed.

The motherboard includes one PCIe 5.0 M.2 slot to enable the fastest data transfers of up to 128 Gbps*, and all M.2 slots support NVMe RAID configurations to leverage current high-speed storage options. * Actual transmission speed will be lower than theoretical maximum speed.

This motherboard provides extensive modern connectivity including PCIe 5.0, a rear USB 20Gbps Type-C® port, a front USB 10Gbps Type-C® connector, and a Thunderbolt™ (USB4®) header, ensuring high-bandwidth options for a wide range of external devices.
This motherboard provides extensive modern connectivity including PCIe 5.0, a rear USB 20Gbps Type-C® port, a front USB 10Gbps Type-C® connector, and a Thunderbolt™ (USB4®) header, ensuring high-bandwidth options for a wide range of external devices.


AI Cache Boost is a BIOS setting exclusive to ASUS AMD 800 and 600 series motherboards that use Ryzen™ 9000 Series CPUs; it optimizes CPU cache and memory pathways to deliver up to 29% faster local LLM performance with high-speed memory tuning. Internal testing showed enabling AI Cache Boost delivered up to a 15% performance uplift when large language models exceeded graphics card memory, and with high-speed DDR5 memory plus additional Infinity Fabric clock (FLCK) tuning, that uplift nearly doubled.

AI Cache Boost is a BIOS setting exclusive to ASUS AMD 800 and 600 series motherboards that use Ryzen™ 9000 Series CPUs; it optimizes CPU cache and memory pathways to deliver up to 29% faster local LLM performance with high-speed memory tuning. Internal testing showed enabling AI Cache Boost delivered up to a 15% performance uplift when large language models exceeded graphics card memory, and with high-speed DDR5 memory plus additional Infinity Fabric clock (FLCK) tuning, that uplift nearly doubled.



















Please Note: Product images are for illustrative purposes only and may differ from the actual product.
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