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Engineered with the needs of modern content creators in mind, the LiveMixer series delivers superior connectivity options to support streaming and a variety of peripheral devices. Its consistent reliability ensures that you can focus on productive content creation with fewer technical interruptions.

Engineered with the needs of modern content creators in mind, the LiveMixer series delivers superior connectivity options to support streaming and a variety of peripheral devices. Its consistent reliability ensures that you can focus on productive content creation with fewer technical interruptions.

Featuring upgraded 20K Black capacitors, this board increases service life to 20,000 hours while boosting capacitance from 560uF to 1000uF. This upgrade offers higher charge storage for heavy loads, reduced power output ripples, more consistent current, and improved overall system stability.

Featuring upgraded 20K Black capacitors, this board increases service life to 20,000 hours while boosting capacitance from 560uF to 1000uF. This upgrade offers higher charge storage for heavy loads, reduced power output ripples, more consistent current, and improved overall system stability.

Built with a robust 14+2+1 power phase layout, this motherboard ensures seamless CPU power delivery, supporting impressive overclocking and efficient operation. Integrating Dr. MOS power stages optimizes voltage regulation and thermal efficiency, allowing higher current delivery to each phase.
Built with a robust 14+2+1 power phase layout, this motherboard ensures seamless CPU power delivery, supporting impressive overclocking and efficient operation. Integrating Dr. MOS power stages optimizes voltage regulation and thermal efficiency, allowing higher current delivery to each phase.


High-performance overclocking requires reliable power transmission. ASRock’s Hi-Density Power Connectors are designed to handle larger current loads than standard ATX or CPU connectors, effectively minimizing fire risks and improving system stability during intense operations.

High-performance overclocking requires reliable power transmission. ASRock’s Hi-Density Power Connectors are designed to handle larger current loads than standard ATX or CPU connectors, effectively minimizing fire risks and improving system stability during intense operations.

The implementation of 8 Layer PCB technology ensures stable signal traces and refined power distribution. This design contributes to lower operating temperatures and higher energy efficiency, particularly when pushing memory modules to extreme overclocked speeds.
The implementation of 8 Layer PCB technology ensures stable signal traces and refined power distribution. This design contributes to lower operating temperatures and higher energy efficiency, particularly when pushing memory modules to extreme overclocked speeds.


With a total of 23 USB ports available, this motherboard provides extensive connectivity options. This setup offers far more stability and reliability for multiple external peripherals than traditional third-party USB hubs.

With a total of 23 USB ports available, this motherboard provides extensive connectivity options. This setup offers far more stability and reliability for multiple external peripherals than traditional third-party USB hubs.

Ultra USB Power technology converts +12V power to 5V to ensure a stable supply with minimal voltage drop under load. This design significantly reduces noise interference from RGB lighting and other connected devices, resulting in a cleaner and more professional auditory experience.
Ultra USB Power technology converts +12V power to 5V to ensure a stable supply with minimal voltage drop under load. This design significantly reduces noise interference from RGB lighting and other connected devices, resulting in a cleaner and more professional auditory experience.

Everything you need to know about this product
This motherboard is optimized for AMD Ryzen™ 9000, 8000, and 7000 Series processors.
The motherboard features an extensive array of 23 USB ports, providing more reliable connectivity for multiple external devices compared to standard hubs.
The design ensures seamless and stable power delivery to the CPU, which supports advanced overclocking and helps maintain performance even at lower temperatures.
Yes, it includes a front panel USB 3.2 Gen2x2 Type-C header capable of transfer speeds up to 20 Gbps.
It converts +12V power to 5V to minimize voltage drops and reduce noise interference from other devices, which leads to a cleaner and improved auditory experience.
These capacitors offer an extended lifespan of 20,000 hours and an increased capacitance of 1000uF, which improves charge storage, reduces ripple, and enhances system stability.
Yes, the 8 Layer PCB design provides stable signal traces and optimized power distribution, which is specifically designed to support extreme memory overclocking.
They are engineered to handle higher current loads than standard CPU and ATX connectors, ensuring greater system stability and reducing the risk of heat-related issues during intense overclocking.
AI-Generated Content: These FAQs are generated by an automated AI system and may contain inaccuracies or omissions. Evetech makes no warranties, express or implied, regarding their completeness or reliability. For definitive information, please refer to the manufacturer's official specifications.












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